Thermal interface materials
Heat source, contact area, gap and thickness.
Evaluation focusMatch measurement locations and check temperature rise and interfaces.
THERMAL / PROTECTION / PROCESS
A material family covering thermal interfaces, protective coatings and sealing materials for electronic assemblies. Select an exact grade for the required role.

Confirm composition, temperature range, viscosity or consistency, material compatibility and required registrations for the exact grade.
APPLICATION & SELECTION
Where thermal transfer, protection and fixing overlap, consider interface geometry, thickness, stress and dispensing alongside individual property values.
Heat source, contact area, gap and thickness.
Evaluation focusMatch measurement locations and check temperature rise and interfaces.
Joint geometry, displacement, environment and assembly sequence.
Evaluation focusCompare joint deformation and post-durability condition.
Prioritize functions and identify trade-offs.
Evaluation focusEvaluate each function against application acceptance criteria.

PROCESS ENGINEERING
TECHNICAL REVIEW
For numerical specifications, refer to the current grade-specific TDS.
Thickness, interface contact and geometry also matter. Review documented test conditions and evaluate temperature and durability on the actual assembly.
DOCUMENTS & SAMPLES
Request the information you need for product selection and internal evaluation.