PCBA cleaning and defluxing
Identify flux type, soldering conditions, gaps beneath components and the cleaning method.
Evaluation focusEvaluate organic and ionic residues, drying and effects on components, markings and adhesives on assembled boards.
ELECTRONIC FLUORINATED FLUIDS / HFE
Fluorinated fluids
Electronic fluorinated fluids and hydrofluoroethers (HFE). Review chemistry, grade and process for electronic and precision cleaning, solvent and thermal-management uses.
Material features
- Electronic fluorinated fluids
- Hydrofluoroethers (HFE)
- Cleaning and thermal-management uses
Selection criteria
- 01Chemical name, CAS and composition
- 02Substrate, contamination and temperature
- 03Solubility, residue and recovery process
PRODUCT LINEUP
Product lineup
Electronic fluorinated fluids and hydrofluoroethers (HFE). Review chemistry, grade and process conditions for uses such as electronic-component cleaning and thermal management.
Electronic fluorinated fluids & HFE
| Grade / product | Material type | Applications to review |
|---|---|---|
| Electronic fluorinated fluidsEnquire | Fluorinated liquids for electronics | Electronic-component cleaning and thermal-management applications; confirm composition and grade for the intended use |
| Hydrofluoroethers (HFE)Enquire | Hydrofluoroether fluids | Cleaning and solvent uses for electronic and precision parts; review solvency, material compatibility and drying conditions for the selected fluid |
Quote the grade or product name in your enquiry. Composition, numerical properties and use conditions are provided in current product-specific TDS and SDS.
Lubricants for your application
Confirm composition, temperature range, viscosity or consistency, material compatibility and required registrations for the exact grade.
APPLICATION & SELECTION
Cleaning & thermal management
Review electronic fluorinated fluids and HFE for cleaning, solvent and thermal-management uses. Confirm chemistry, grade, contaminants, contact materials, operating temperature and process conditions.
Optical and precision-part cleaning
Contaminants, substrates, gaps and current cleaning process.
Evaluation focusCheck residues, drying and substrate changes after cleaning.
Solvent and formulation uses
Components to dissolve or disperse and the required concentration.
Evaluation focusCompare compatibility, precipitation and applied/dried results.
Thermal-fluid selection
Operating temperature, heat load, wetted components, equipment and recovery conditions.
Evaluation focusCheck grade-specific thermal properties and material compatibility in documentation and the actual equipment.
PROCESS ENGINEERING
Drying & residue testing
- Define the use and target
- Check chemistry & grade
- Trial compatibility
- Check process & recovery
TECHNICAL REVIEW
Composition & handling
For numerical specifications, refer to the current grade-specific TDS.
- Chemical name, CAS and composition
- Confirm records for the grade and intended use.
- Boiling point, viscosity and solubility
- Use grade-specific TDS values and test conditions.
- Residues and material compatibility
- Test actual boards, components, markings, adhesives and optical materials.
- Handling and recovery
- Match equipment conditions with the current SDS.
Frequently asked questions
Can fluorinated liquids be used to clean PCBAs?
Fluorinated solvents have defluxing applications, but neat fluids and formulated cleaners can have different solvency. Select a grade and process for the actual flux and confirm cleaning performance and component compatibility. Evaluate the selected fluid; the electronic-fluorinated-fluid or HFE category alone does not establish cleaning performance.
Are all electronic fluorinated fluids HFE?
No. HFE names the hydrofluoroether chemical family. Electronic fluorinated fluids is a broader application category, so confirm the composition and documentation for the selected grade.
DOCUMENTS & SAMPLES
Documents & evaluation samples
Request the information you need for product selection and internal evaluation.
Explore application requirements
Electronics & semiconductor
Organize bonding, sealing, thermal transfer and board protection around process and reliability needs.
Precision & optical
Evaluate materials for micro torque, cleanliness, low migration and controlled feel.
Industrial & robotics
Evaluate reducer and sliding lubrication by load, speed, temperature and relubrication interval.