AT A GLANCE
Electronic bonding & sealing
Define substrates and joint gap, access for light or heat, dispensing geometry and environmental evaluation. Confirm that the assembly process can support the proposed curing method before comparing candidates.
01 / EXPLORE THE AREAS
Key application points
Bond interface & gap
Record substrates, surface preparation, bond area and gap. Evaluate the actual joint geometry.
- RECORD
- Substrates, surface preparation, bond area and gap
Cure access
Identify shadowed areas, heating constraints and component heat tolerance, then compare these with the candidate cure conditions.
- RECORD
- Light/heat conditions, access and equipment constraints
Dispensing & evaluation
Record dose, bead geometry and time to assembly. Use consistent acceptance criteria before and after environmental testing.
- RECORD
- Dispensing, assembly time, temperature/humidity and acceptance criteria
02 / PLAN THE REVIEW
From records to part testing
- 01
Define a consistent starting point
Record materials, process, current material and the issue. Specify which conditions will change during the comparison.
- 02
Check grade records
Review the current TDS/SDS and test conditions. Separate documented properties from checks requiring actual parts.
- 03
Use matching test criteria
Define the method and acceptance criteria. Record changes before and after treatment or repeated evaluation under consistent conditions.
03 / CONTINUE THE REVIEW
Discuss your component
Electronic adhesivesAdd the conditions you know to the enquiry checklist. If the grade is undecided, start with the requirements needed to review candidates and records.