Define operating conditions
- 01
Bond area and gap
- 02
Heat and moisture
- 03
Dispensing takt
BOND / SEAL
Bond electronic parts
Define substrates, gap, cure process and required strength before selecting material and dispensing.
DIAGNOSTIC FRAMEWORK
Possible causes and checks
Review these possible factors against observed conditions.
Preparation and substrate condition
Record cleaning, preparation and substrate grades, then inspect the interface and failure location.
Cure, gap & dispensing
Review dispensing path, gap, shadowing and thermal history and compare cure state on actual joints.
Stress and thermal/humidity exposure
Record component displacement and interface changes as well as strength before/after exposure.
COMPARATIVE EVALUATION
Comparative test sequence
- Record the baseline
- Compare one factor
- Retest candidate materials
- Review life-test results
TEST BRIEF
Information for your enquiry
- Component and materials
- Material grades, preparation, dimensions, contact surfaces and assembly conditions.
- Environment and operation
- Bond area and gap / Heat and moisture / Dispensing takt
- Process and current material
- Current grade, application/cure/cleaning conditions and when behaviour changed.
- Acceptance and records
- Targets, measurement methods, before/after photographs and values, and required life conditions.
DOCUMENTS & SAMPLES
Documents & evaluation samples
Request the information you need for product selection and internal evaluation.
Discuss these requirements