Define operating conditions
- 01
Exposure environment
- 02
Film thickness and coverage
- 03
Inspection method
SURFACE PROTECTION
Protect PCBs from moisture
Design board protection across film thickness, application, cure, inspection and repair.
DIAGNOSTIC FRAMEWORK
Possible causes and checks
Review these possible factors against observed conditions.
Coverage gaps and coating boundaries
Inspect edges, under-component areas and masking boundaries and compare coverage gaps with symptom locations.
Water/oil exposure and cure state
Separate fluid type, exposure time and temperature and check cure state and post-exposure changes.
Film thickness and rework changes
Use matching inspection methods before/after repair and record thickness, removal areas and recoating boundaries.
COMPARATIVE EVALUATION
Comparative test sequence
- Record the baseline
- Compare one factor
- Retest candidate materials
- Review life-test results
TEST BRIEF
Information for your enquiry
- Component and materials
- Material grades, preparation, dimensions, contact surfaces and assembly conditions.
- Environment and operation
- Exposure environment / Film thickness and coverage / Inspection method
- Process and current material
- Current grade, application/cure/cleaning conditions and when behaviour changed.
- Acceptance and records
- Targets, measurement methods, before/after photographs and values, and required life conditions.
DOCUMENTS & SAMPLES
Documents & evaluation samples
Request the information you need for product selection and internal evaluation.
Discuss these requirements